TLP/VF-TLP/HMM/HBM Calibration Substrate

Features

• High quality ceramic substrate for TLP/VF-TLP/HMM/HBM system wafer-level calibration using ground-signal (GS) RF probes
• Probetip pitch range from 50 µm up to 3 mm
• 9 reference resistors in the range of 0.1, 0.2, 0.5, 1, 5, 10, 50, 100 and 500 Ω for calibration of the current measurement channel
• 8 reference Z-diodes in the range of 5, 6.5 (TVS), 8.75 (Low-Cap TVS), 10, 20, 30 (Low-Cap TVS), 68 and 120 V for calibration of the voltage measurement channel
• 6 open-load and 6 short-circuit test-structures
• 2 timing de-skew landing-pad structures
• 5 custom reference device positions
• Rugged top layer metal gold coating
• Laser marked serial number
• Probe pitch verification ruler 100 µm, 200 µm, 300 µm, 400 µm, 500 µm, 600 µm
• Size 24 mm x 24 mm (fits on AUX chuck)
• Protective case
• Calibration datasheet

Download: Product Datasheet CAL-03A

TLP/VF-TLP/HMM/HBM Ceramic Calibration Substrate (Size 24 mm x 24 mm)

Protective Case