Fully automated test and probing solution for HBM, TLP, HMM and CC-TLP on package- and wafer-level.

High Power Pulse Instruments GmbH
Advanced TLP/HMM/HBM Solutions
Fully automated test and probing solution for HBM, TLP, HMM and CC-TLP on package- and wafer-level.
Probe Arm
Accurate Sub-ns Timing
High performance wafer-level calibration substrate for accurate calibration of the VF-TLP/TLP/HMM/HBM system.
High performance GND clamps for flex-pitch application
80A VF-TLP/TLP, 15kV HMM plus optional 6kV HBM (JEDEC) system. Optional pulse width extender TLP-3011C, TLP-8012A5
Including all required accessories for VF-TLP/TLP/HMM/HBM
80A VF-TLP/TLP + 15kV HMM + 6kV HBM (JEDEC)